发明名称 |
POLYIMIDE FILM |
摘要 |
The present invention relates to a polyimide film, and discloses a polyimide film having a low degree of thermal expansion and little difference in the degree of expansion in the widthwise direction and in the degree of expansion in the mechanical direction of the film, so as to retain dimensional stability even under extreme heat conditions. |
申请公布号 |
WO2011013904(A3) |
申请公布日期 |
2011.04.14 |
申请号 |
WO2010KR04018 |
申请日期 |
2010.06.22 |
申请人 |
SKCKOLON PI INC.;WON, DONG YOUNG;KIM, SUNG WON |
发明人 |
WON, DONG YOUNG;KIM, SUNG WON |
分类号 |
C08J5/18;C08G73/10;C08L79/08 |
主分类号 |
C08J5/18 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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