| 摘要 |
1,184,701. Bonding. PHILIPS ELECTRONIC & ASSOCIATED INDUSTRIES Ltd. 19 May, 1967 [23 May, 1966], No. 23318/67. Heading B3R. A method of bonding an aluminium surface to a second metal surface, comprising the steps of sputtering a firmly adherent layer of tantalum, titanium, or niobium, on to the aluminium surface, then depositing a layer of platinum on to the firmly adherent layer, and a gold layer on to the platinum, and then bonding the so-covered aluminium surface to the second metal surface. The second metal surface may be pre-tinned copper, a metallized aluminium oxide, or a metal layer applied to an aluminium oxide ceramic body. The appropriate thickness of the titanium, platinum, and gold is 6600A, 7,000Š, and 18,000Š, respectively. The bonding is carried out with the aid of soft solder of 95 parts by weight of tin, and 5 parts by weight of silver. |
