| 发明名称 |
SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE, AND METHOD OF MANUFACTURING THE SAME |
| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To improve reliability of a semiconductor integrated circuit device including a fuse element for performing laser trimming work. <P>SOLUTION: By setting a space width between first-layer aluminum wires for connecting adjacent fuse elements less than twice of sidewall thickness of a first-layer inter-metal insulating film, exposure of hygroscopic SOG is prevented. Reliability is further improved by arranging a side spacer on a first-layer aluminum wire-side face. <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
| 申请公布号 |
JP2011071324(A) |
申请公布日期 |
2011.04.07 |
| 申请号 |
JP20090221238 |
申请日期 |
2009.09.25 |
| 申请人 |
SEIKO INSTRUMENTS INC |
发明人 |
MINAMI YUKIMASA;AKINO MASARU |
| 分类号 |
H01L21/82;H01L21/3205;H01L23/52 |
主分类号 |
H01L21/82 |
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