| 摘要 |
PROBLEM TO BE SOLVED: To provide a multicavity wiring substrate capable of maintaning reliability by stable operation of an electronic component in which a mother board and a metal frame are jointed via a brazing material. SOLUTION: In the multicavity wiring substrate, a metal frame 7 is bonded, via a brazing material 6, to a frame type metallized layer 2 formed surrounding a mounting part 1a of the electronic component at the upper surface of the mother board 1 formed of a ceramic sintered material, a diving channel 3 is formed along the boundary of a wiring board region at the lower surface of the mother board 1, a recessed area 4 is formed in contact with the external circumference of the metallized layer 2, and a projecting material 5 formed of the ceramic sintered material having a hole coefficient higher than that of the mother board 1 is provided to be projected from the upper surface of the metallized layer 2 from such recessed area 4. Since the projecting material 5 prevents displacement of the metal frame 7 against the mother board 1 to assure highly accurate bonding of the metal frame 7, an electronic component can be operated stably and air-tightness after a cover is bonded for sealing can be maintained. COPYRIGHT: (C)2011,JPO&INPIT
|
