FOREIGN MATERIAL INSPECTING METHOD AND FOREIGN MATERIAL INSPECTING APPARATUS
摘要
<p>Disclosed are a method and an apparatus for accurately detecting defects of wafers having patterns, such as wafers of semiconductor devices, and defects of liquid crystal substrates and those of media. The inspecting apparatus has: an irradiation optical system which radiates light to a substrate to be inspected; a detection optical system which detects light from the substrate to be inspected; and a spatial filter which blocks diffracted light from the substrate to be inspected. The spatial filter has: a plurality of light blocking members; a control member which changes at least the shape, angle or interval of the blocking members; and a control unit which controls the control member.</p>
