发明名称
摘要 PROBLEM TO BE SOLVED: To peel quickly an extremely thin chip stuck on a dicing tape therefrom, without generating its cracking and its breaking. SOLUTION: Into the central portion of a sucking collet for peeling the chip stuck on the dicing tape therefrom, three blocks 107-109 are integrated for thrusting up thereby the dicing tape. In the three blocks 107-109, the second block 108 having its diameter smaller than the one of the first block 107 largest in the diameters of the three blocks is disposed inside the first block 107, and further, the third block 109 whose diameter is the smallest in the diameters of the three blocks is disposed inside the second block 108. Hereupon, in each corner of the four corners of the first block 107, each protrusion 110a is so formed integrally with the block 107 as to be extended to the direction of each corner of the chip. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP4664150(B2) 申请公布日期 2011.04.06
申请号 JP20050227894 申请日期 2005.08.05
申请人 发明人
分类号 H01L21/67;H01L21/301;H01L21/52 主分类号 H01L21/67
代理机构 代理人
主权项
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