| 摘要 |
<p>The invention relates to a structure 20 comprising a substrate 12, a chip 16 bonded to the substrate by means of a bonding adhesive, wherein the bonding adhesive comprises light absorbing and/or light reflecting particles for protecting the chip from the ambient light. The adhesive may be used to fill all cavities 13a, 13b, 13c between the chip 16 and the substrate 12. The invention further relates to a display and an electronic apparatus comprising said structure.</p> |
