发明名称 |
Packaging methods for imager devices |
摘要 |
An imager device is disclosed which includes at least one photosensitive element positioned on a front surface of a substrate and a conductive structure extending at least partially through an opening defined in the substrate to conductively couple to an electrical contact or bond pad on the front surface. An insulating material of a conductive laminate film and/or a mold compound material is positioned within the opening between at least a portion of the conductive structure and the substrate. Also disclosed is a device that comprises a substrate and a plurality of openings in the substrate, wherein each of the openings is adapted to be positioned above an imager device when the substrate is positioned above and secured to an imager substrate. A method of forming an imager device is also disclosed.
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申请公布号 |
US7919410(B2) |
申请公布日期 |
2011.04.05 |
申请号 |
US20070685808 |
申请日期 |
2007.03.14 |
申请人 |
APTINA IMAGING CORPORATION |
发明人 |
ENGLAND LUKE;KINSMAN LARRY |
分类号 |
H01L31/0232;H01L21/44 |
主分类号 |
H01L31/0232 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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