发明名称 PIEZOELECTRIC VIBRATION CHIP
摘要 <P>PROBLEM TO BE SOLVED: To suppress transmission of joint stress to a vibration region 52 even when a conductive bump 73 with strong joint stress is used. <P>SOLUTION: In a crystal vibration piece 2, a vibration part 51 in which a pair of excitation electrodes 61, 62 are formed and the vibration region 52 is constituted, and a joint part 53 in which a pair of terminal electrodes 63, 64 joined to the outside are formed, are integrally provided to a substrate 21 on which principal surfaces 22, 23 are formed approximately in a rectangular shape. The conductive bumps 73 are formed on the pair of terminal electrodes 63, 64, respectively, and the pair of terminal electrodes 63, 64 are electrically connected to the pair of excitation electrodes 61, 62, respectively. In addition, in the crystal vibration piece 2, a notch 81 which blocks transmission of the joint stress to be produced on the substrate 21 to the vibration region 52 is provided between the vibration part 51 and the joint part 53 when the pair of terminal electrodes 63, 64 are joined to electrode pads 36, 37 of a base 3 via the bumps 73. <P>COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2011066779(A) 申请公布日期 2011.03.31
申请号 JP20090217053 申请日期 2009.09.18
申请人 DAISHINKU CORP 发明人 SATO SHUNSUKE;KODA NAOKI;YOSHIOKA HIROKI
分类号 H03H9/19;H01L41/09;H01L41/18;H01L41/22;H01L41/29;H01L41/313;H03H9/10 主分类号 H03H9/19
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