| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a photosensitive resin composition capable of forming a cured coating which is important as a solder resist for a semiconductor package and has PCT resistance, HAST resistance, electroless gold plating resistance, cold shock and thermal shock resistances; to provide a dry film and a cured product of the composition; and to provide a printed wiring board with a cured coating, such as a solder resist, formed of those. <P>SOLUTION: The photosensitive resin composition comprises: a carboxyl group-containing photosensitive resin obtained by reacting a reaction product, obtained by reacting a phenolic resin with an alkylene oxide or a cyclocarbonate compound, with an isocyanate compound having one or more acryloyl groups or methacryloyl groups per molecule and reacting the resulting reaction product with a polybasic acid anhydride; and a photoinitiator. In a preferable embodiment, the composition further comprises a thermosetting component. <P>COPYRIGHT: (C)2011,JPO&INPIT |
