发明名称 PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR FORMING CURED FILM, CURED FILM, ORGANIC EL DISPLAY DEVICE AND LIQUID CRYSTAL DISPLAY DEVICE
摘要 <P>PROBLEM TO BE SOLVED: To provide a photosensitive resin composition which provides a cured film excellent in transparency, heat-resistant transparency and pattern configuration and having a high dielectric breakdown voltage, to provide a cured film excellent in transparency, heat-resistant transparency and pattern configuration and having a high dielectric breakdown voltage, to provide a method for forming the cured film, and to provide an organic EL display device and a liquid crystal display device each including a cured film excellent in transparency, heat-resistant transparency and pattern configuration and having a high dielectric breakdown voltage. <P>SOLUTION: The photosensitive resin composition contains (A) an alkali-soluble resin, (B) a crosslinkable acrylic resin having an epoxy group and/or an oxetanyl group, (C) a polymeric photosensitizer, and (D) a solvent. The method for forming a cured film, the cured film, the organic EL display device and the liquid crystal display device are provided each using the photosensitive resin composition. <P>COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2011064869(A) 申请公布日期 2011.03.31
申请号 JP20090214318 申请日期 2009.09.16
申请人 FUJIFILM CORP 发明人 YAMADA SATORU;FUJITA AKINORI;HIKITA MASANORI;KAWABE YASUMASA
分类号 G03F7/023;C08F212/08;C08F220/18;C08G59/68;C08G65/18;C08K5/04;C08K5/3492;C08L25/14;C08L101/12;G02F1/1333;G03F7/004;G03F7/40 主分类号 G03F7/023
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