METHOD OF MANUFACTURING SUBSTRATE FOR POWER MODULE, SUBSTRATE FOR POWER MODULE, SUBSTRATE FOR POWER MODULE INCLUDING HEAT SINK, AND POWER MODULE

摘要

PROBLEM TO BE SOLVED: To provide a method of manufacturing a substrate for power modules for obtaining a substrate for power modules, where a metal plate is easily and reliably joined to a ceramics substrate at low costs and heat cycle reliability is high. SOLUTION: The method has: an Si and Cu sticking process S1 for sticking Si and Cu onto at least one of a joining surface of the ceramics substrate and a joining surface of the metal plate; a lamination process S2 for stacking the ceramics substrate to the metal plate via the stuck Si and Cu; a heating process S3 for performing pressing and heating in a stacking direction to form a molten metal region; and a solidification process S4 for solidifying the molten metal region. In the Si and Cu sticking process S1, Si and Cu are interposed in the interface between the ceramics substrate and the metal plate with content of respectively not less than 0.002 mg/cm2and not more than 1.2 mg/cm2and not less than 0.08 mg/cm2and not more than 2.7 mg/cm2. In the heating process S3, Si and Cu are diffused to the metal plate side to form the molten metal region. COPYRIGHT: (C)2011,JPO&INPIT