| 摘要 |
A method executes computerized instructions stored within a computer storage medium within an integrated and packaged semiconductor device using a centralized programming interface within the packaged semiconductor device to perform in-system preventive and recovery actions, configure and issue stimulus to chips, components and sensors within the semiconductor device. The method monitors chip, components and sensors within the packaged semiconductor device, using the centralized programming interface, to measure characteristics of the packaged semiconductor device in response to the stimulus. The structure including chips, components and sensors produce outputs representing the characteristics. The method performs an engineering evaluation to determine whether the chip, component and sensor outputs are within predetermined limits, using the centralized programming interface; and reports occurrences of instances of the chip, component and sensor outputs being outside the predetermined limits, using the centralized programming interface, to an on-chip storage medium, external test equipment or computerized device outside of the packaged semiconductor device. The instructions cause the centralized programming interface to alter actions, configurations, frequencies and types of the stimulus, engineering evaluations, and reports depending upon whether the characteristics are within the predetermined limits in order to recover from and prevent failure. |
