| 摘要 |
PURPOSE: A pad layout structure of driver an IC chip is provided to prevent a fail of supplying power due to the reduction of an adhesive force in a certain part by distributing the contact location of a power pad and a ground pad. CONSTITUTION: In a pad layout structure of driver an IC chip, main power pads(221a,221b,224a,224b) supply power to a driver IC chip(200). Main ground pads(222a,222b,223a,223b) supply at least one ground voltage to a driver IC chip. Dummy power pads(241a,241b,244a,244b) are formed at four corners of the driver IC chip and are connected to the main power pad through a metal line. Dummy ground pads(242a,242b,243a,243b) are formed at four corners of the driver IC chip.
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