发明名称 TRANSPARENT ELECTRICALLY CONDUCTIVE TRANSFER PLATE AND PRODUCTION METHOD THEREFOR, TRANSPARENT ELECTRICALLY CONDUCTIVE BASE, METHOD FOR PRODUCING TRANSPARENT ELECTRICALLY CONDUCTIVE BASE USING TRANSPARENT ELECTRICALLY CONDUCTIVE TRANSFER PLATE, AND MOLDED ARTICLE USING TRANSPARENT ELECTRICALLY CONDUCTIVE BASE
摘要 <p>The present invention provides a process for producing a transparent conductive substrate which is capable of readily producing the transparent conductive substrate having a low resistance, a high transmittance and an excellent anti-moire property without using a special apparatus and can be applied to production of various extensive substrates; a transparent conductive substrate having a sufficiently high optical transparency and electromagnetic shielding property which can be readily subjected to molding process as well as a process for producing the transparent conductive substrate; and a transparent conductive molded product. According to the present invention, it is possible to readily produce a transparent conductive substrate having a low resistance, a high transmittance and an excellent anti-moire property which can be applied to extensive substrates by applying a dispersion solution of metal fine particles capable of forming a self-organized film on a support, drying the obtained coating layer and then subjecting the resulting dried material to heat treatment and/or chemical treatment or applying a solution of a precursor of the metal fine particles on a support, drying the obtained coating layer and then reducing and precipitating the precursor of the metal fine particles, to previously form a transparent conductive film exhibiting a low resistance, a high transmittance and an excellent anti-moire property and having a conductive random network structure on the support; and then bonding a substrate to the support to transfer the transparent conductive film onto the substrate directly or through a heat-sensitive adhesive layer or a pressure-sensitive adhesive layer and releasing the support from the transparent conductive film is laminated on a substrate.</p>
申请公布号 EP2302645(A1) 申请公布日期 2011.03.30
申请号 EP20090773169 申请日期 2009.06.30
申请人 TODA KOGYO CORPORATION;FUJICOPIAN CO., LTD. 发明人 KAKIHARA, YASUO;KYOTO, MICHIHISA;SUZUKI, KYOICHI
分类号 H01B13/00;H01B5/14;H05K9/00 主分类号 H01B13/00
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