| 摘要 |
PURPOSE: A semiconductor package and a method of manufacturing a semiconductor package are provided to reduce the size of a semiconductor package by reducing the height of a bonding wire. CONSTITUTION: In a semiconductor package and a method of manufacturing a semiconductor package, a first semiconductor chip(200) comprises a plurality of first chip pads along one side. A second semiconductor chip has a stepped part in which a fist chip pad is exposed to outside, a plurality of second chip pads are formed along one side. A stepped pad has an adhesive pad attached to the first semiconductor chip and also includes a conductive pad which is formed on the adhesive pad. A first bonding wire(500) electrically connects one second chip pad to one first chip pad or connects one first chip pad to one bonding pad. A second bonding wire(600) electrically connects one second chip pad to one bonding pad. |
