METHOD OF POLISHING SUBSTRATE

摘要

PURPOSE: A method of polishing a substrate is provided to remove an oxide film from the surface of a wafer by using a stock pad and final slurry in polishing. CONSTITUTION: In a method of polishing a substrate, stock grinding is performed to make the surface of a wafer even(S2). Final grinding is performed by making the surface of the wafer smooth(S3). The wafer is polished firstly using a first smooth polish pad and colloidal slurry containing a polymer(S31). The polished wafer is polished secondly by using a second polish pad that is smoother than the first polish pad(S32).