发明名称 |
METHOD OF MANUFACTURING CERAMIC SUBSTRATE, LIGHT EMITTER, AND LIGHT EMITTING DEVICE |
摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method of manufacturing a ceramic substrate wherein solder can stick exactly to the wiring layer of a ceramic substrate and can resist the load applied to the ceramic substrate efficiently, and to provide a light emitter having this ceramic substrate, and to provide a light emitting device with the light emitter. <P>SOLUTION: The method of manufacturing the ceramic substrate 3 includes a blasting process for forming a curved surface 34 where the outer edge side is recessed more than the inside by blasting the outer edge side of the substantially flat backside in the ceramic substrate 3, and a wiring layer forming process for forming a wiring layer 6 on the curved surface 34 formed by the blasting process. <P>COPYRIGHT: (C)2011,JPO&INPIT |
申请公布号 |
JP2011060831(A) |
申请公布日期 |
2011.03.24 |
申请号 |
JP20090205934 |
申请日期 |
2009.09.07 |
申请人 |
TOYODA GOSEI CO LTD |
发明人 |
SHIMONISHI SHOTA;TAJIMA HIROYUKI |
分类号 |
H01L33/48;B24C1/00;B24C3/32;H01L23/12 |
主分类号 |
H01L33/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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