| 摘要 |
PURPOSE: A USB(Universal Serial Bus) memory package and a manufacturing method thereof are provided to reduce manufacturing costs by simplifying a manufacturing process by forming a sealing unit which seals a LED device and a semiconductor integrated circuit into an opaque resin. CONSTITUTION: A plurality of wiring patterns(112a, 112b) is formed on the top side of a substrate(100). A passive device(120), a controller, and a flash memory(140) are connected to a wiring pattern of the substrate. A signal control unit is connected to the wiring pattern of the substrate and implements a calculating process. An LED device(160) is connected to the wiring pattern of the substrate. A sealing unit seals the passive device, the controller, the flash memory, the signal control unit, and the LED device with an opaque resin. |
