| 摘要 |
<P>PROBLEM TO BE SOLVED: To planarize the bottom surface of a hollow formed in the top surface of a substrate and surfaces of through electrodes when forming the through electrodes by providing through-holes in the bottom surface of the hollow, thereby improving reliability of an electronic device mounted in the hollow. <P>SOLUTION: An electrode 11 is arranged on the undersurface 5 of the package substrate 1 to seal through-holes 4. A metal is filled in the through-holes 4 by electroplating using the electrode 11 as a cathode to form through electrodes 21. This allows easy fitting of the through electrodes 21 in the through holes 4, to planarize the bottom surface 6 of the hollow and the surfaces of the through-holes 4. <P>COPYRIGHT: (C)2011,JPO&INPIT |
