| 摘要 |
<p>The present invention relates to the use of a sputtering cathode of the magnetron type for depositing thin films for solar cells and to the use of a control method for such a device for, in a vacuum process, depositing very thin films for depositing thin films for solar cells. In particular, the sputtering device comprises a magnet system disposed behind the target and comprising at least three permanent magnets connected to each other by means of a yoke, each of the permanent magnets having a different polarity, wherein the permanent magnets is adapted to interact with each other so as to form a magnetic flux line plateau having magnetic flux lines being substantially parallel with the sputtering surface of the target.</p> |
