FILM FOR FORMING SPACER, METHOD FOR MANUFACTURING SEMICONDUCTOR WAFER BONDED BODY, SEMICONDUCTOR WAFER BONDED BODY, AND SEMICONDUCTOR DEVICE

摘要

Disclosed is a method for manufacturing a semiconductor wafer bonded body. The method has: a step of preparing a film for forming a spacer, said film being provided with a sheet-like supporting base material, and a photosensitive spacer-forming layer provided on the supporting base material; a step of adhering the spacer-forming layer on one surface of a semiconductor wafer; a step of forming spacers by patterning the spacer-forming layer by exposure and development, and removing the supporting base material; and a step of bonding a transparent substrate on spacer portions that were in contact with the supporting base material such that the transparent substrate is included as the inner side of the spacers. Thus, the semiconductor wafer bonded body wherein the semiconductor wafer and the transparent substrate are uniformly and reliably bonded to each other with the spacers therebetween can be manufactured.