| 摘要 |
<p>PURPOSE: A method for cutting a substrate is provided to reduce the rate of defects during the cutting of a substrate by automatically correcting the defective form of a unit substrate through feedback and management. CONSTITUTION: A supporting unit(121) supports a substrate. A scribing wheel(123) forms a scribe line. A mobile unit(125) transfers the scribing wheel. The scribing wheel forms a scribe line on the substrate which has been placed on the supporting unit. The mobile unit transfers the scribing wheel in a straight line according to a cutting guiding line on the substrate.</p> |
