发明名称 SPUTTERING APPARATUS
摘要 There is provided an inexpensive sputtering apparatus in which self-sputtering can be stably performed by accelerating the ionization of the atoms scattered from a target. The sputtering apparatus has: a target which is disposed inside a vacuum chamber so as to lie opposite to the substrate W to be processed; a magnet assembly which forms a magnetic field in front of the sputtering surface of the target; and a DC power supply which charges the target with a negative DC potential. A first coil is disposed in a central portion of a rear surface of the sputtering surface of the target. The first coil is electrically connected between the first power supply and the output to the target. When a negative potential is charged to the target by the sputtering power supply, the electric power is charged to the first coil, whereby a magnetic field is generated in front of the sputtering surface.
申请公布号 US2011062019(A1) 申请公布日期 2011.03.17
申请号 US20090991961 申请日期 2009.06.04
申请人 MORIMOTO NAOKI;KONDO TOMOYASU;NAGASHIMA HIDETO;MORI DAISUKE;SANO AKIFUMI 发明人 MORIMOTO NAOKI;KONDO TOMOYASU;NAGASHIMA HIDETO;MORI DAISUKE;SANO AKIFUMI
分类号 C23C14/35 主分类号 C23C14/35
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