| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device preventing the occurrence of peeling by improving adhesion between a lead and a sealing body (mold sealing body) in a semiconductor device including a semiconductor chip, a plurality of leads electrically connected to the semiconductor chip and comprising a metal as a main constituent material, and a sealing body for sealing the semiconductor chip. <P>SOLUTION: A semiconductor device includes a semiconductor chip 5, a plurality of leads 3 electrically connected to the semiconductor chip and comprising the metal as a main constituent material, and a sealing body 2 for sealing the semiconductor chip. In order to improve adhesion between the leads 3 and the sealing body (mold sealing body), a material combination with good lattice matching is used as a combination of a surface material of the leads 3 and the sealing body 2, and the sealing body 2 comprising acenes as a main constituent material is used. <P>COPYRIGHT: (C)2011,JPO&INPIT |
