PROTECTION LAYER FOR ADHESIVE MATERIAL AT WAFER EDGE

摘要

A wafer is attached to a carrier by using an adhesive layer, and a portion of the adhesive layer is exposed adjacent to an edge of the wafer. After thinning the wafer, a protection layer is provided to cover the exposed portion of the adhesive layer. A plurality of dies is bonded onto the thinned wafer, and then the thinned wafer and the dies are encapsulated with a molding compound.