| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide an activated resinous composition which realizes the following effects: (1) in surface mounting technology, a washing process of flux is made to be unnecessary, and the reduction of production cost and the improvement of productivity are achieved; (2) air bubbles, voids, etc., do not appear absolutely in an applied resin layer after hardening, thus improving the reliability of a product; (3) the applied resin layer after hardening is made to be highly thermally stable and does not generate a corrosion reaction or a cracked gas at a heating time (e.g., at a heat hardening time of an underfill resin); and (4) the filling of the underfill resin is made easy, and therefore, even when a large-sized BGA part is mounted, air bubbles, voids and other unfilled airspaces do not occur in a filled cured section of the underfill resin, thus enabling sure joining (adhesion) and improvement of the reliability of the product. <P>SOLUTION: The activated resinous composition includes 100 pts.wt. of an epoxy resin being solid at a room temperature, 1-10 pts.wt. of a carboxylic acid compound, 1-30 pts.wt. of a hardening agent with a hardening reaction initiation temperature of 150°C or higher, and 10-300 pts.wt. of a solvent. <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
