发明名称 LASER BEAM MACHINING APPARATUS
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a laser beam machining apparatus that performs machining while automatically recognizing machining regions corresponding to a workpiece. <P>SOLUTION: The laser beam machining apparatus includes: a machining means 2 that converges a laser beam L from a laser oscillating means 13 to emit the laser beam to the workpiece W of a metallic plate in which a projected frame Wf is provided on the periphery; a machining position moving means 12 that moves the machining position of the machining means 2 in the planar direction relative to the workpiece W; and a control means 11 that controls the laser oscillating means 13 and the machining position moving means 12. The apparatus is also equipped with a projected frame position detecting means 15 for detecting the position of the projected frame Wf of the workpiece W. The control means 11 determines, on the basis of the positional information from the projected frame position detecting means 15, a machining regions where the machining means 2 does not come into contact with the projected frame Wf of the workpiece W. The control means then drives and controls the machining position moving means 12 in a manner displacing the machining position of the machining means 2 within the machining region. <P>COPYRIGHT: (C)2011,JPO&INPIT</p>
申请公布号 JP2011050992(A) 申请公布日期 2011.03.17
申请号 JP20090202659 申请日期 2009.09.02
申请人 NIPPON SHARYO SEIZO KAISHA LTD 发明人 FURUTA YASUYUKI
分类号 B23K26/00;B23K26/08;B23K26/10 主分类号 B23K26/00
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