| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide an electronic component-packaging device and a method of packaging electronic components, capable of preventing mixed mount of components that belongs to different lots in a packaging form for packaging a plurality of electronic components of the same type on a substrate. <P>SOLUTION: In packaging work for packaging electronic component of the same type on a multiple substrate, shortage in electronic components is detected when take-out of the electronic components from a component supply section fails continuously a prescribed number of times (ST4). When absence of stock of components is detected during unit substrate-packaging work targeted to one unit substrate, packaging point cancellation processing (ST9) for suspending the unit substrate-packaging work targeted to one unit substrate is performed for shifting to the unit substrate-packaging work targeted to the next unit substrate. At the same time, lot change processing (ST10) is performed, where the component supply section to be operated is changed from a component supply section set at a point of time concerned to another component supply section. <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
