LAMINATION METHOD OF ADHESIVE TAPE AND LEAD FRAME

摘要

PURPOSE: A lamination method of an adhesive tape and a lead frame is provided to prevent a sealing material from exposed by forming an inter-penetration net structure. CONSTITUTION: In a lamination method of an adhesive tape and a lead frame, an adhesive tape(3) for an electronic component is laminated in a lead frame(4). The lamination temperature of a lead frame surface is lower than that of the adhesive tape to reduce the warpage of the lead frame due to thermal expansion. The adhesive tape includes a heat-proof member and the adhesive layer. The component of the adhesive includes a phenoxy resin, a thermosetting material, and a cure type acrylic resin.