DEVICES HAVING A THERMAL INTERFACE AND METHODS OF FORMING THE SAME
摘要
A conduction-cooled enclosure comprises a card guide having a card guide channel, at least one controlled-volume cavity in the card guide channel, and a thermal interface material (TIM) in the at least one controlled-volume cavity.
申请公布号
US2011058335(A1)
申请公布日期
2011.03.10
申请号
US20090556293
申请日期
2009.09.09
申请人
HYBRICON CORPORATION
发明人
SULLIVAN ROBERT C.;PALIS MICHAEL R.;PELLECCHIA RYAN
