| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a display device having a Cu alloy film having high adhesiveness to a transparent substrate and a low electrical resistivity. <P>SOLUTION: The Cu alloy film for a display device is directly brought into contact with a transparent substrate, and has a multilayer structure which includes: a first layer (Y) composed of a Cu alloy containing, in total, 2 to 20 atm% of at least one element selected from a group composed of Zn, Ni, Ti, Al, Mg, Ca, W, Nb and Mn; and a second layer (X) composed of pure Cu or substantially a Cu alloy having Cu as the main component and having an electrical resistivity lower than that of the first layer (Y). The first layer (Y) is brought into contact with the transparent substrate. <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
