| 摘要 |
PROBLEM TO BE SOLVED: To provide a cooling system utilizing a thermosyphon having superior energy-saving performance and ecological measure by efficient cooling, and a structure of an electronic device suitable for the cooling system. SOLUTION: This cooling system for the electronic device for cooling a CPU 200 loaded on a circuit board 100 in a housing, includes a heat receiving jacket 310 thermally connected with a surface of the CPU generating heat, and evaporating a liquid refrigerant received in an internal space of which a pressure is reduced by the heat generation, a condenser 320 receiving refrigerant vapor from the cooling jacket in the pressure-reduced internal space and transporting heat to the external of the device to condense the refrigerant vapor into liquid, a steam pipe 331, and a liquid return pipe 332, and utilizes the thermosyphon circulating the refrigerant by phase change. The condenser is composed of a flat tube having fine grooves along the refrigerant flowing direction on its inner wall surface and having a flat cross-section to efficiently cool the refrigerant vapor from the heat receiving jacket by its inner wall face. COPYRIGHT: (C)2011,JPO&INPIT |
