| 摘要 |
PURPOSE: A method for evaluating a via hole of a printed circuit board and manufacturing a test board are provided to obtain various optimum process conditions by nondestructive inspection, thereby reducing costs and time for research and development. CONSTITUTION: A plurality of copper foil pads is repetitively arranged on both sides of a copper foil circuit. The copper foil pads have a shape that a plurality of rectangular pads is arranged. Rectangular copper foil pads(10a,10b,10c) of an upper side are overlapped with rectangular copper foil pads(30a,30b,30c) of a lower side. Solders(50) are formed on a copper pad of an end of an upper side of a core layer and a copper pad of the other end of a lower end. Via holes(100a,100b,100c,100d,100e) penetrate an insulating layer(90,100) and a core layer.
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