发明名称 |
Biocompatible bonding method and electronics package suitable for implantation |
摘要 |
The invention is directed to a method of bonding a hermetically sealed electronics package to an electrode or a flexible circuit and the resulting electronics package, that is suitable for implantation in living tissue, such as for a retinal or cortical electrode array to enable restoration of sight to certain non-sighted individuals. The hermetically sealed electronics package is directly bonded to the flex circuit or electrode by electroplating a biocompatible material, such as platinum or gold, effectively forming a plated rivet-shaped connection, which bonds the flex circuit to the electronics package. The resulting electronic device is biocompatible and is suitable for long-term implantation in living tissue.
|
申请公布号 |
US7904148(B2) |
申请公布日期 |
2011.03.08 |
申请号 |
US20060517860 |
申请日期 |
2006.09.07 |
申请人 |
SECOND SIGHT MEDICAL PRODUCTS, INC. |
发明人 |
GREENBERG ROBERT J.;TALBOT NEIL;OK JERRY;NEYSMITH JORDAN;ZHOU DAO MIN |
分类号 |
A61N1/00;A61N1/05;A61N1/375;H05K1/03;H05K3/00;H05K3/32;H05K3/36;H05K3/40;H05K3/42;H05K3/46 |
主分类号 |
A61N1/00 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|