A PRINTED CIRCUIT BOARD AND A FABRICATING METHOD THE SAME

摘要

PURPOSE: A printed circuit board and a manufacturing method thereof are provided to reduce manufacturing costs by sufficiently securing adhesion between a plating layer and an insulation layer without a copper foil by pressing a release film with a surface roughness to an insulation layer to transfer the surface roughness on the insulation layer. CONSTITUTION: An inner insulation layer(102) has a surface roughness. An inner circuit layer is formed on the inner insulation layer and is comprised of an electroplating layer and an electroless plating layer. A surface roughness is transferred on the inner insulation layer by pressing a release film(104) with the surface roughness on both sides of the inner insulation layer.