| 摘要 |
<P>PROBLEM TO BE SOLVED: To improve the electrical conductivity and heat conductivity of a through electrode 6 formed on an insulating substrate 2. <P>SOLUTION: The electronic device 1 includes the insulating substrate 2 having a depression 4 on its top surface and a through-hole 3 formed penetrating through the bottom of the depression 4 to the rear side of the insulating substrate, the through electrode 6 filled in the through-hole 3 and formed by heat treatment of nano metal particles, an electronic part 7 retained in the depression 4 and electrically connected to the through electrode 6, and a seal part 9 to seal the electronic part 7, thereby improving the electrical conductivity and heat conductivity of the through electrode 6. <P>COPYRIGHT: (C)2011,JPO&INPIT |
