发明名称 SMART CARD FABRICATING METHOD USING INJECTION MOLDING
摘要 PURPOSE: A smart card producing method using injection molding is provided to improve durability since a substrate and an injection molded material are strongly coupled by through-holes for injection molding. CONSTITUTION: A smart card producing method using injection molding comprises following steps. Multiple injection molding through-holes are formed along the edge of a region, where a card body is formed, of a substrate. One or more chip inserting through-holes(12,13) are formed in a location for IC(Integrated Circuit) chip insertion. An individual sheet with the injection molding through-holes and the chip inserting through-holes is manufactured. As, melted material is injected along the edge of the individual sheet, an injection molded material(22) is formed at the edge of the sheet to constant thickness and width.
申请公布号 KR101017425(B1) 申请公布日期 2011.02.28
申请号 KR20100058025 申请日期 2010.06.18
申请人 LIM, HOE JIN;PARK, YOUNG BOK 发明人 LIM, HOE JIN;PARK, YOUNG BOK
分类号 B29C45/14;B29C45/00 主分类号 B29C45/14
代理机构 代理人
主权项
地址