| 摘要 |
PURPOSE: An adhesive tape composition for electronic components is provided to ensure enough thermal resistance in case of adhering electronic components and to prevent corrosion of a lead frame and adhesive. CONSTITUTION: An adhesive tape composition for electronic components contains 1-200 weight parts of epoxy resin composition, 0.1-100 weight parts of phenoxy, 0.01-10 weight parts of corrosion inhibitor, and 5-20 weight parts of hardener. The phenoxy resin is selected from bisphenol A type, bisphenol F type, phosphorous-based phenoxy, bisphenol S type, PKHB, PKHC, PKHH, PKHJ, PKFE, PKHP-200, PKHS-30, PKHM-30, LER derivative, SER-10, SER-25, and LEN-HB. |
