发明名称 AlxGa(1-x)As Substrate, Epitaxial Wafer for Infrared LEDs, Infrared LED, Method of Manufacturing AlxGa(1-x)As Substrate, Method of Manufacturing Epitaxial Wafer for Infrared LEDs, and Method of Manufacturing Infrared LEDs
摘要 Affords AlxGa(1-x)As (0≦̸x≦̸1) substrates, epitaxial wafers for infrared LEDs, infrared LEDs, methods of manufacturing AlxGa(1-x)As substrates, methods of manufacturing epitaxial wafers for infrared LEDs, and methods of manufacturing infrared LEDs, whereby a high level of transmissivity is maintained, and through which, in the fabrication of semiconductor devices, the devices prove to have superior characteristics. An AlxGa(1-x)As substrate (10a) of the present invention is an AlxGa(1-x)As substrate (10a) furnished with an AlxGa(1-x)As layer (11) having a major surface (11a) and, on the reverse side from the major surface (11a), a rear face (11b), and is characterized in that in the AlxGa(1-x)As layer (11), the amount fraction x of Al in the rear face (11b) is greater than the amount fraction x of Al in the major surface (11a). In addition, the AlxGa(1-x)As substrate (10a) is further furnished with a GaAs substrate (13), contacting the rear face (11b) of the AlxGa(1-x)As layer (11).
申请公布号 US2011042706(A1) 申请公布日期 2011.02.24
申请号 US20090990646 申请日期 2009.05.27
申请人 SUMITOMO ELECTRIC INDUSTRIES, LTD. 发明人 TANAKA SO;MIYAHARA KENICHI;KITABAYASHI HIROYUKI;KATAYAMA KOJI;MORISHITA TOMONORI;MORIWAKE TATSUYA
分类号 H01L33/30;H01L21/20;H01L29/20;H01L33/00;H01L33/02;H01L33/46 主分类号 H01L33/30
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