| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To improve sealability for a through electrode 6 formed in an insulating substrate 2. <P>SOLUTION: The through electrode 6 formed in a through-hole 3 of the insulating substrate 2 is constituted of a mixed member 4 comprising metal and an inorganic material, and an alloy member 5 comprising Au (gold) and Sn (tin), and is constituted to cover the mixed member 4 by the alloy member 5. The sealability for the through electrode 6 is enhanced and joinability between the mixed member 4 and a side wall of the through-hole 3 is enhanced by this manner, a hole of the mixed member 4 is filled to prevent an impurity and moisture from entering from an outside, and the sealability is enhanced thereby. <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
