| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a printed circuit board in which effects of a lead for plating exerted on a waveform of an electrical signal is reduced, and a method of manufacturing the same. <P>SOLUTION: A base insulating layer 11 is formed on a suspension body 10. A lead wire S for plating and a wiring pattern 20 are integrally formed on the base insulating layer 11. A cover insulating layer 13 is formed on the base insulating layer 11 to cover the lead wire S for plating and the wiring pattern 20. The thickness of a portion of the cover insulating layer 13 above a region R1 of the base insulating layer 11 in which the lead wire S for plating is formed is set smaller than the thickness of a portion of the cover insulating layer 13 above other regions of the base insulating layer 11. <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
