| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a photosensitive resin composition having excellent sensitivity, resolution and adhesiveness, and giving a pattern having excellent heat resistance, low water absorption and a good shape even when used in a low-temperature curing process at ≤280°C, a method for producing a pattern, and electronic components. <P>SOLUTION: The photosensitive resin composition comprises (a) a polybenzoxazole precursor having a repeating unit represented by formula (I), (b) a photosensitizing agent and (c) a solvent, wherein U or V denotes a divalent organic group and includes a specific structure. <P>COPYRIGHT: (C)2007,JPO&INPIT |
