| 摘要 |
A method of manufacturing an electronic device comprising a device substrate 1 which may be flexible, or rigid and supporting a patterned layer 7 of active material 6 is disclosed. The method comprises providing a device substrate which has a substantially uniform surface. The surface is patterned 11. An unpatterned layer of active material 6 is provided on a carrier substrate 4 for example, an organosilane carrier substrate. A patterned layer of active material 7 is formed correspondingly on the patterned device substrate surface by urging the device substrate 1 and carrier substrate 4 together so as to bring the patterned device substrate surface into contact with the unpatterned layer of active material. The device substrate 1 and carrier substrate 4 are then separated. The device substrate 1 may comprise a layer of material selected from glass, polymer politics of oil, paper, inflated-coated metal, pull you think, polycarbonate, polysulfone, polyarlayte, acrylonitrile butadiene styrene, 1-methoxy-2-propyl acetate (SU-8), pollyhydroxybenzyl silsesquioxane, polyimide, benzocyclobutene, aluminium oxide, SixONy, silicon dioxide, Si3N4. The patterning may comprise imprinting said substantially uniform surface with a stamp 2 provided on a substantially cylindrical roller 3. The patterning may comprise forming at least one feature with at least one dimension in the range 30 to 300 nm. The active material may be a polymer semiconductor material. |
