| 摘要 |
The present invention consists in a method for the manufacture of electronic circuit boards with grooves for massive connections, resulting from the use of a first upper mould and a second lower mould, each of said moulds includes a specific structural configuration, which allow them to work together over a layer of plastic material, said layer consisting of a mixture of fibre glass and a thermostable polymer, specifically epoxy resin, which results in an electronic circuit board with grooves for connections, having a specific structural configuration according to the moulds implemented during the manufacture thereof, where the board thus obtained comprises a couple of cavities useful as a fastener for fixing the interconnection wire located between the terminals of the elements arranged over said board.
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