| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a high frequency module that is miniaturized and lowered in a height. <P>SOLUTION: The high frequency module 100 includes a module substrate 10 in which external connection terminals 11 including ground terminals 12 are formed on the lower surface thereof, a plurality of electronic components 20 mounted on the upper surface of the module substrate 10, a sealing member 30 constituted of an insulating resin and formed on the upper surface of the module substrate 10 so as to seal the electronic components 20, and a shield case 40 disposed above the electronic components 20. The shield case 40 includes a top plate 41 and suspension parts 43 extending downward from the top plate 41, and the distal end parts of the suspension parts 43 are positioned in the vicinity of the ground terminals 12. <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
