发明名称 SEMICONDUCTOR DIE SORTER FOR WAFER LEVEL PACKAGING
摘要 A die sorter for sorting a semiconductor dice is provided. The die sorter comprising of a rotary turret module (19) with indexing mechanism for die sorting; the rotary turret module (19) is further coupled with a motor for generating rotating movements. A plurality of flipper modules (20) with rotary actuating means (72) is coupled with the rotary turret module (19) for enabling the flipping process of the flipper module (20). In one embodiment, a plurality of shutter openers (55) are operatively coupled to the flipper module (20) to move the cavity shuttle (93) to open position for pick and place operation of die. In one preferred embodiment, a plurality of cavity releasing means (57) are operatively coupled to the flipper module (20) to unlock the cavity holder (74) prior to activate the flipping mechanism, whereby the cavity releasing means (57) is a cam mechanism which is mounted on the rotary turret module (19). The flipper module (20) further comprises of a cavity lock (75) to secure the flipper module (20) in horizon position as well to prevent it from drifting. In one preferred embodiment, the shutter openers (55) are operatively coupled to a motor whereby with a single rotating movement of the motor either clockwise or counter clockwise will open the cavity shuttle (93) will be open.
申请公布号 US2011038694(A1) 申请公布日期 2011.02.17
申请号 US20090988149 申请日期 2009.04.10
申请人 KHOO HUN SNIAH 发明人 KHOO HUN SNIAH
分类号 H01L21/677;H01L21/68;H01L21/683 主分类号 H01L21/677
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