| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device that can improve electric connection reliability between a columnar member electrically connected to a ground layer and a shield case, and to provide a method of manufacturing the semiconductor device. SOLUTION: The semiconductor device is provided with the columnar member 15 having a first end surface 61A opposed to a pad 28 provided to a wiring board 11, a first end part 15A constituting the first end surface 61A, a second end surface 61B opposed to the shield case 19, a second end part 15B constituting the second end surface 61B, and a through hole 62 penetrating the first and second end surfaces 61A and 61B, and made of a metal material; first conductive paste 13 bonding the first end part 15A of the columnar member 15 to the pad 28; and second conductive paste 18 bonding the second end part 15B of the columnar member 15 to the shield case 19. COPYRIGHT: (C)2011,JPO&INPIT
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