发明名称 |
Programmable via structure and method of fabricating same |
摘要 |
A method of fabricating a programmable via structure is provided. The method includes providing a patterned heating material on a surface of an oxide layer. The oxide layer is located above a semiconductor substrate. A patterned dielectric material is formed having a least one via on a surface of the patterned heating material. The at least one via is filled with a phase change material such that a lower surface of the phase change material is in direct contact with a portion of the patterned heating material. A patterned diffusion barrier is formed on an exposed surface of the at least one via filled with the phase change material. A method of programmable a programmable via structure made by the method is also disclosed.
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申请公布号 |
US7888164(B2) |
申请公布日期 |
2011.02.15 |
申请号 |
US20090538120 |
申请日期 |
2009.08.08 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
CHEN KUAN-NENG;KRUSIN-ELBAUM LIA;LAM CHUNG H.;YOUNG ALBERT M. |
分类号 |
H01L21/02 |
主分类号 |
H01L21/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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