发明名称 INTERFACE FIN ASSEMBLY KIT
摘要 PURPOSE: An interface pin assembly kit of semiconductor package test jig is provided to reduce the working time. CONSTITUTION: An assembling panel(106) is installed on the top of a support panel(102) of the square shape, and is equipped with a plurality of insertion holes(104) on a certain portion of the main body. A first securing protrusion(108) and a second securing protrusion(110) are projected on both edges of the top of the assembly panel in order to secure the semiconductor package jig for testing.
申请公布号 KR101013592(B1) 申请公布日期 2011.02.14
申请号 KR20100090053 申请日期 2010.09.14
申请人 CHOI, YOUNG CHUL;APL 发明人 CHOI, YOUNG CHUL
分类号 G01R1/067;G01R31/26;H01L21/66 主分类号 G01R1/067
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